In this work, PS multilayer-based heat storage structures were
developed based on PS films coated with PCL/PCM electrospun layers.
An additional PCL electrospun layer (without PCM) was also
electrospun in some cases to improve PCM efficiency. The results
show that the melting behaviour of the encapsulated PCM was
similar to that of the pure PCM but a multiple crystallization profile
was observed for the encapsulated PCM. While the pure PCM crystallizes
at 5.3 C, a greater supercooling degree was observed in all
PS-multilayer structures. This supercooling effect can be explained
by a reduction of the PCM particle size.