Improving measurement quality for testing solder joints on silicon solar cells includes many aspects. Firstly there is no standardization. Different test conditions like pull angle and test velocity implicates difficulties concerning comparability between different users. The second aspect is that it has to be assured that only the UIM is tested instead of silicon underneath. The disadvantage of common testers is that the cell is fixed while the ribbon is pulled. This can be improved by applying an opposing force on the ribbon at the point of test load application. Silicon disruptions will then not lead to large area tears, but only when extensive pre-cracks are present over the solder joint. First experiments show that testing without opposing force produces large area silicon tears without measurable pull forces. To stop spreading micro cracks underneath the UIM, pull testing with opposing force leads to small disruptions only.