A standard thermoelectric module utilizes the Seebeck, Peltier and Thomson effects and can operate as a heat pump, providing heating or cooling of an object connected to one side of the module if a DC current is applied to the module terminals. Alternatively, a module can generate a small amount of electrical power if a temperature difference is maintained between two terminals [2]. Historically, the motivation for using thermoelectric modules to cool microelectronic integrated circuits in the computer industry has been used to increase their clock speed below ambient temperatures, which can be advantageous in some situations [3] and [4]. As integrated circuit power and power density continue to increase, the computer industry may begin to approach the limit of forced-air cooled systems and will need to find alternative solutions [3]. Thermoelectric technology has been highlighted as a possible solution to these problems [5], and there is evidence of ongoing research into cooling the whole of a microprocessor with a thermoelectric module, and focus on cooling microprocessor ‘hot spots’ using embedded micro-thermoelectric devices incorporated into the microprocessor die [6].