Based on conventional semiconductor packaging technologies, we have developed small size fiber optic transceiver (FOT) modules for large core fiber systems.
A photo of a pair of 7-pin high speed FOT transmitter and receiver modules is shown in Fig. 3.
The outer dimensions of 9.7mm x 6.2mm x 3.6mm are very small compared to conventional optical transceiver modules.
The optoelectronic components and ICs are directly assembled onto a lead frame platform and encapsulated with polymers of suitable mechanical and optical properties.
The maximum operating temperature is up to +105℃, much higher compared to typical datacom (+85℃) devices.
The transmitter and receiver modules are mirror images of each other.
They both contain seven electrical leads for through-hole mounting.
Two are for power supply, two for differential data channel, and others for control purposes.