Micropelt was the first company to deploy ready-to-use microcoolers in the market. This company was created under a joint-venture formed by the Infinion Technologies and the Fraunhofer Institute for Physical Measurement Techniques (IPM), and it presents a fabrication process that allows the fabrication of thermoelectric elements with reduced dimensions. This fabrication process uses two wafers (with the n-type and p-type elements) that are glued together in order to construct sub-millimetre sized Peltier elements. These Peltier present cooling capabilities above 100 Wcm-2 [9] for gradient temperatures up to 30 K at the room temperature.
Efforts to use MEMS (Micro-Electro-Mechanical Systems) techniques in the fabrication of thermoelectric devices had been made by the Jet Propulsion Laboratory (JPL, NASA) and by IPM. An electrodeposition process is used by JPL [5], while at the same time a sputtering and dry-etching processes were developed by IPM to fabricate thermoelectric structures. Additionally, Völklein [10] explores the use of tellurides for