AM techniques, since inception, have been extensively used for successful rapid prototyping of mechanical structures. These technologies were exceptionally well suited for the fabrication of complex geometries, which allowed designers to verify the fit and form of a product within a few hours of completing the CAD design [1]. However due to the limitations resulting from the distinct material requirements for AM processing, the designer was unable to fabricate the prototype in the material required for the end-use final product [2]. AM has also been used to improve TTM through rapid tooling in which molds could be fabricated more quickly and then subsequently used in a traditional manufacturing process [3] – in this case, proving vital in cost and time-savings for the development process. Further, AM technologies have also been used to produce end-use parts in low volumes through rapid manufacturing techniques that proved to be economic because there was no need for tooling and logistics costs were decreased [4]. However, in the context of prototyping electronic circuits, which are increasingly encased in 3D forms, rapid prototyping only provided fit and form verification of the housing. In order to verify functionality, a separate bread boarding activity was required that did not integrate the verification of form with function – two separate activities