I. INTRODUCTION
The trend in wireless communication systems is to develop a low profile antenna with lightweight, small size and low cost with high performance. The widespread utilization of microstrip antennas in these systems stems from their simplicity, and their compatibility with millimeter wave and microwave applications [1]. However, despite the advantages microstrip patch antennas provide, they do have some limitations that restrict their applications, such as inherently narrow bandwidth low gain, spurious feed radiation and poor polarization purity [2]. The task of designing a suitable antenna for MMIC integration applications becomes much more challenging [3-4]. Typically, MMIC substrate are electrically thin, and of high dielectric constant. However, the many limitations alluded to above have to be overcome in order to design microstrip antennas at microwave or millimeter wave frequencies on semiconductor substrates [5]. At millimeter wave frequencies, additional issues have to be overcome in
order to design a microstrip antenna with acceptable performance on high dielectric substrate such as small physical size, amount of wafer space consumed and fabrication tolerances [6]. Hence, major dilemmas still impeding the creation of MMIC compatible antennas are small physical size at high frequency, layer alignment in multi-layered antennas, large amounts of space consumed on the MMIC wafer, etc d[7].Thus, in this paper, we proposed examine novel methods for integrating and constructing broadband microstrip antennas, particularly at high microwave and millimeter wave frequencies where dimensions get very small and fabrication tolerances are critical.