whereas a significant subcooling is unavoidable (Lu and Tassou, 2013). For example, Khan and Afroz (2015) integrated a eutec- tic aqueous NaCl solution (ω=0.1 g/g) with a melting temperature of −5 °C in the evaporator of a household refrigerator, but for initiating the solidification evaporator coil temperatures below −12 °C were necessary. By comparison, the present paraffin de- rivative shows no significant sub-cooling. In this case, the temperature of the evaporator, where the PCM undergoes so- lidification, can be higher, which is crucial for performance increase. An additional advantage of polymerization is form- stability of the PCM elements. Moreover, it avoids leaking of the PCM in its “liquid” state so that macro-encapsulation is not necessary. Finally, the thermal conductivity of the PCM of λ = 0.19 W/(m K) was increased by adding a specific graphite (THERMOPHIT GFG, SGL GROUP), depending on its mass frac- tion ω by up to a factor of 20 to λ = 3.95 W/(m K) for ω ≈ 0.3 g/g.