OUR SERVICES
A high-precision assembly is essential to your product, we provide you with our German-engineered development and manufacturing assembly services, ensuring high-precision and “Made in Germany” quality for every aspect of your developing and manufacturing process. With our everything-from-one-source-service we take over responsibilities for e.g. hermetic packaging, thermal design, HF design, electronic assembly, and platform supply.
OUR TECHNOLOGY
We develop packaging and assembly concepts for photonic and semiconductor components with the focus on high-precision assembly down to ± 0.5 µm. Using state-of-the-art equipment which we specify, select, and improve for optimal realization of your optical subassembly, the eutectic and epoxy bonding are the main applied technologies. We support all leading-edge process benches such as glass, ceramic, polymer, PCB, and silicon.
OUR SERVICESA high-precision assembly is essential to your product, we provide you with our German-engineered development and manufacturing assembly services, ensuring high-precision and “Made in Germany” quality for every aspect of your developing and manufacturing process. With our everything-from-one-source-service we take over responsibilities for e.g. hermetic packaging, thermal design, HF design, electronic assembly, and platform supply.OUR TECHNOLOGYWe develop packaging and assembly concepts for photonic and semiconductor components with the focus on high-precision assembly down to ± 0.5 µm. Using state-of-the-art equipment which we specify, select, and improve for optimal realization of your optical subassembly, the eutectic and epoxy bonding are the main applied technologies. We support all leading-edge process benches such as glass, ceramic, polymer, PCB, and silicon.
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