Following the addition of shape memory, as described above, we further increased the added value of polylactic acid by developing a polylactic acid composite of high thermal conductivity that can contribute to better heat dissipationa major issue in the design of today's electronic equipment. As electronic devices become ever smaller and thinner, the rise in temperature inside their housing, due to internal heat generation, is becoming a serious challenge, but it is difficult to deal with this using conventional parts for promoting heat dissipation, such as fans and sheets. In addition, when stainless steel or other metallic material is used for a device housing, heat conductivity is high only in the direction of the thickness, resulting in localized points of high temperature around the outside of the device, and to discomfort during use. Furthermore, since metals have a higher specific gravity than plastic, it is more difficult to reduce their weight and more demanding to form them into complicated shapes.