The hybrid diamond/graphite films were prepared at a
microwave power of 10 kW in a microwave plasma chemical vapor
deposition system (915 MHz). The gas pressure in the chamber was
held at 70 mbar and the substrate temperature was kept at around
1050 ◦C during film deposition. The flow rate of H2 was 400 sccm
and the flow rates of CH4 were kept at 28, 32 and 36 sccm for obtaining
the diamond/graphite films with different sp2 levels. Diamond
films under lower microwave power (4 kW) and lower methane
concentration (3%) were also prepared as comparisons to seek for
the formation condition of hybrid diamond/graphite films. B-doped
diamond films used in this work were also grown by conventional
MPCVD setup. During the deposition process, the microwave
power was 1.8 kW, the reactive temperature and gas pressure were
around 800 ◦C and 60 mbar, respectively. Trimethylborane (TMB,
1.5% diluted in H2) was used as the boron source. Prior to deposition,
p-type (100) Si wafers were ultrasonically seeded in diamond
nanoparticle slurry for 30 min to enhance the nucleation density.
Then Si wafers were cleaned in ethanol and dried under nitrogen
gas. All films were deposited on substrates for 3 h.
The hybrid diamond/graphite films were prepared at amicrowave power of 10 kW in a microwave plasma chemical vapordeposition system (915 MHz). The gas pressure in the chamber washeld at 70 mbar and the substrate temperature was kept at around1050 ◦C during film deposition. The flow rate of H2 was 400 sccmand the flow rates of CH4 were kept at 28, 32 and 36 sccm for obtainingthe diamond/graphite films with different sp2 levels. Diamondfilms under lower microwave power (4 kW) and lower methaneconcentration (3%) were also prepared as comparisons to seek forthe formation condition of hybrid diamond/graphite films. B-dopeddiamond films used in this work were also grown by conventionalMPCVD setup. During the deposition process, the microwavepower was 1.8 kW, the reactive temperature and gas pressure werearound 800 ◦C and 60 mbar, respectively. Trimethylborane (TMB,1.5% diluted in H2) was used as the boron source. Prior to deposition,p-type (100) Si wafers were ultrasonically seeded in diamondnanoparticle slurry for 30 min to enhance the nucleation density.Then Si wafers were cleaned in ethanol and dried under nitrogengas. All films were deposited on substrates for 3 h.
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