The micro capacitive sensor is fabricated on glass substrate by electroplating technology, the main fabrication process steps and material of the initial micro capacitive sensor are shown in Fig. 5 and described as follows.
(a) Clearing the glass substrate, chromium/copper (10 nm/90 nm) was sputtered as the seed layer based on glass substrate for the plating of the device structure on, then 1 m thick photoresist spin-coating, prebaking and photolithography were carried out.
(b) Through RIE (reactive ion etching), insulated channel was formed by removing the exposed seed layer.
(c) 4 m thick photoresist spin-coating and photolithography by using mask of fixed plate