Ever though III–V solar cells have demonstrated superior performance,
but production of low cost high efficiency III–V solar
cells is still challenge due to expensive materials cost including
Au-based and Ag-based contact metallurgy. Substituting costly
Au-based or Ag-based contacts and interconnects with low-cost
Cu-based systems are being considered. However, the Cu-based
contacts to III–V material face severe issue of rapid Cu diffusion
into the material and formation of deep acceptor levels