Antimonide cobalt thin films were deposited by IBSD and the
influence of deposition temperature on the properties is investigated.
The prepared antimonide cobalt thin films show the mixed
Sb and CoSb3 phase at low deposited temperature and then transform
to the dominant CoSb2 phase when the deposition temperature
were in the range from room-temperature to 500 C. The
grain sizes of antimonide cobalt thin films at first decrease and
then increase with increasing deposition temperature. A highest
electrical conductivity as large as 5.6 104 S cm1 at room
temperature is obtained when the thin film deposited at 450 C,
which has largest carrier concentration. But the Seebeck coefficient
of this sample is very small. The PF of the thin film deposited at
250 C has a highest value with a large Seebeck coefficient of
52 lV/K and a moderate value of electrical conductivity. It is several
times than that of others, indicating that the thin film with
mixed Sb and CoSb3 phase has better thermoelectric properties
than that of the thin films have CoSb2 phase. Also, it increases
when the measuring temperature increased and reaches to
3.5 104Wm1 K2 at 540 K.