1. Noise irritation in the trim–form (1.6) and testing (1.9) processes,
2. The lack of floor space (1.8) that congested the flow of materials and workers in the die bonding process,
3. Headaches (1.7) in the plating process
4. Physical body pain on neck and back in the die-bonding (1.6) and wire-bonding (1.8) processes.