Generally, the organic compositions that are best suited for high aspect ratio pastes do not lend themselves to a production environment. As an example, faster drying solvents could give improved slumping characteristics, but they would also lead to clogged screens. Additionally, they may not dissolve resins that burn out cleanly during firing. The organic composition also determines wetting and adhesion to the surface of the wafer and is of great importance. Critical choices in materials must be made to find the best balance of properties for screen printable pastes suitable for high aspect ratios.