In conclusion, it was determined that the physical and mechanical properties of industrial particleboard panels improved by using corn flour in UF resin, and the formaldehyde emission in particleboard panels decreased. Since the industry requires compromises between the best performance and the lowest cost of such materials and considering the low amount of corn flour (7%) and the low cost and fast preparation method that was performed in the present work, the results of this study are considered satisfactory. From this work, it has been shown that corn flour are promising materials for the improvement of the UF resin performance and so, further studies to this direction are worthwhile.