As reported in [22], patterning of features to 20 nm and
below has been demonstrated by a variety of techniques.
Newer techniques likes 248 nm radiation has been used to
make 9 nm devices. However, the complexity of the processes
involved may cause such approaches to be uneconomical. In
addition, non-radiation patterning techniques
(e.g. nanoimprintlithography) also appear very attractive but presently lack the
investment needed to make them attractive for semiconductor
IC manufacturing[22].