Fig. 3: Measured peel-off force Fpeel for rear bus bar pastes with a varying amount of silver content. Bus bar pastes with a silver content csilver
> 36 % reach a peel-off force Fpeel > 1 N/mm as requested for module reliability.
Figure 3 shows the measured peel-off force Fpeel for rear bus bar pastes with a silver content 35 % < cAg < 42 %.
In this test, we solder a conventional solder ribbon with a width of 1.5 mm on top of the bus bars. Subsequently we