STATS ChipPAC Ltd. (“STATS ChipPAC” or “the Company” - SGX-ST: STATSChP) is a leading provider of advanced semiconductor packaging and test services. STATS ChipPAC’s full turnkey semiconductor solutions include package design, bump, probe, assembly, test and distribution services. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the communication, consumer and computing markets.