A typical cure cycle for RTM6 consists of a 1 °C/min ramp from 80 °C to 180 °C followed by a 180 °C isothermal step during 2 h. However, based on previous studies [38] and [39] about thermal dissolution and interdiffusion of phenoxy filaments in RTM6 resin, a modified curing profile has been used to maximize phenoxy diffusion before the occurrence of cross-linking. The modified RTM cycle is as follows: 1 °C/min ramp from 80 °C to 120 °C, followed by 30 min isotherm, followed by 1 °C/min ramp up to the 180 °C, followed by isotherm for 2 h.