4. Conclusion
SnO2 thin films, with high density, high purity, and good crystallinity were successfully deposited by using SnCl4 and O2 plasma by PEALD method. The GPC of PEALD-SnO2was saturated at 0.072 nm/cycle, which was almost two times higher than the reported GPC (0.04 nm/cycle) of thermal ALD. Moreover, the resulting films were free from Cl impurities, even at a low growth temperature of 150 °C. The density, crystallinity of the films, and oxygen with no stoichiometry of the films were improved with increases in the growth temperature. Due to those improvements with increasing growth temperature, PEALD-SnO2 thin films prepared at 350 °C exhibited the lowest electrical resistivity and the best corrosion resistance.
Acknowledgments
This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology (2014R1A1A2054737).