This study develops a hybrid cooling system that combines the advantages of a liquid cooling system and
a vapor compression refrigeration system (VCRS). This hybrid cooling system uses Al2
O3/water nanofluid
and hydrocarbon refrigerant as the working liquid and VCRS cooling for the CPU. A heating module was
used to simulate the heat of the CPU at different power levels. The surface temperature of the heating
module and pumping power consumption under various experimental parameters were measured to
assess the performance and feasibility of the hybrid cooling system. Experimental results show that
the maximum cooling capacities of the liquid, VCRS, and hybrid cooling systems are 450 W, 270 W,
and 540 W, respectively. Using Al2
O3/water nanofluid instead of distilled water in liquid cooling system
leads to greater heat dissipation performance, greater power consumption for the water pump, and a
lower surface temperature on the heater. In addition to cooling electronic chips, the hybrid cooling system can be used in other heat dissipation applications involving high-heat components to increase system performance and extend the lifetime of the apparatus or equipment