Thermal stability of PLA/CNC nanocomposites with 3 and 5% of
HCL- LA- and AA-CNCs was analyzed by TGA. Plots of TGA temperature
scans and DTG curves under air are displayed in Fig. 6 and
corresponding tabulated T5%, T10% and T50% data is in Table SI-2. All
nanocomposites had similar thermal stability when performed
under an inert nitrogen atmosphere (data not shown), regardless of
the surface functionalization of the CNCs or their dispersion in
matrices. However, when TGA analysis was performed under air,
there is a clear trend, which can be indicative of the dispersion state
of the different CNCs in the corresponding PLA matrix. All nanocomposites
suffer from reduced thermal stability under oxygen
when compared with neat PLA. The thermal stability was the
lowest in the case of PLA/HCl-CNC nanocomposites. Values of T5%
and T50% of 336 C and 359 C for neat PLA were reduced to 307 C
and 338 C for PLA with 5% HCl-CNCs. This decrease in thermal
stability was less pronounced for PLA nanocomposites containing
AA-CNCs and LA-CNCs, with T5% and T50% for PLA/5%AA-CNC being
321 C and 349 C, respectively, and PLA/5%LA-CNC being 326 C
and 354 C, respectively. The large decrease in thermal stability for
PLA nanocomposites with HCl-CNCs can be attributed to weak
adhesion between HCl-CNCs and PLA, and, therefore, poor dispersion
in the PLA matrix.
Thermal stability of PLA/CNC nanocomposites with 3 and 5% ofHCL- LA- and AA-CNCs was analyzed by TGA. Plots of TGA temperaturescans and DTG curves under air are displayed in Fig. 6 andcorresponding tabulated T5%, T10% and T50% data is in Table SI-2. Allnanocomposites had similar thermal stability when performedunder an inert nitrogen atmosphere (data not shown), regardless ofthe surface functionalization of the CNCs or their dispersion inmatrices. However, when TGA analysis was performed under air,there is a clear trend, which can be indicative of the dispersion stateof the different CNCs in the corresponding PLA matrix. All nanocompositessuffer from reduced thermal stability under oxygenwhen compared with neat PLA. The thermal stability was thelowest in the case of PLA/HCl-CNC nanocomposites. Values of T5%and T50% of 336 C and 359 C for neat PLA were reduced to 307 Cand 338 C for PLA with 5% HCl-CNCs. This decrease in thermalstability was less pronounced for PLA nanocomposites containingAA-CNCs and LA-CNCs, with T5% and T50% for PLA/5%AA-CNC being321 C and 349 C, respectively, and PLA/5%LA-CNC being 326 Cand 354 C, respectively. The large decrease in thermal stability forPLA nanocomposites with HCl-CNCs can be attributed to weakadhesion between HCl-CNCs and PLA, and, therefore, poor dispersionin the PLA matrix.
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