Prediction
I predict that the outcome to be is that as the amount of input
increases, the amount of copper being gained increases. I predict
that, initially a higher current will result in more copper being
transferred onto the cathode, but with a much poorer standard of
adhesion. And that repeats carried out at lower currents will be
characterised by small amounts if better adhered metal being
transferred. The optimum conditions will be a compromise between these
two, a layer of metal plate applied as rapidly as possible yet
maintaining a high degree of adhesion.