Precision manufacturing processes are defined here as those for
which there is a very small amount of material removed (per cutting
edge, for example) and for which the surface or feature created can
be characterized by stringent tolerances on form, dimension or surface
characteristics. We will emphasize here processes with very
small chip thickness, acav , as defined below as well as processes for
which no discernible “chip” is produced but features are created
never-the-less. These processes include abrasive machining (including
lapping, polishing and honing) and can be characterized by either
two body or three body abrasive interactions. The nontraditional
processes include those Taniguchi referred to as “ultrahigh precision
machining” such as atomic bit processing with electron beams or
or evaporation such as AFM and STM processing.
There are various ways to classify precision material removal
processes. We have presented one above, based on the “uncut chip
thickness”, and will discuss this in more detail. A convenient classification
is based upon “energy source” driving the removal process.
electrolytic polishing, photon sputtering or electric field “removing