Additional Advantages / Benefits
MIL-I-46058C, Type XY approved
FDA approved -- USP XXII, Class VI bio-compatibility rating
UL listed
Completely pin-hole free barrier coating
Fully conformal on any type of surface material or design
Inert transparent polymer
Meets NBC requirements (AR70 / AFR80-38 / Navinst 3400.2)
Barrier to oxygen, moisture, chemicals, solvents, and carbon dioxide
Thermal mechanically stable between -200ºC and 150ºC
Extremely high dielectric 5,000 volts per 0.001" minimum
Excellent adhesion properties
Low stress coating that does not form sites prone to crack initiation
Low / minimal impact on package cooling
Hydrophobic
Barrier to ionic and moisture species
Chemical and fungal resistance
Non-contaminating coating and coating process -- no solvents, catalysts or other by-products are introduced during coating
Entire process is accomplished at room temperature, alleviating temperature stress on parts
Particle encapsulation / immobilization
No outgassing (NASA approved)
High reliability - Suitable for military or commercial applications
Light weight - compared to other coatings
Stress-free coatings - Sensitive circuitry unchanged by coating
Low coefficient of friction - Use as a dry film lubricant
Transparency - Thin films can be of optical quality
Outgassing - Virtually none
Outstanding barrier - Very low permeability to moisture and gases
Fungus and bacteria resistance - Excellent
Mechanical - High tensile and yield strength
Radiation resistance - Suitable for space applications
Additional Advantages / BenefitsMIL-I-46058C, Type XY approvedFDA approved -- USP XXII, Class VI bio-compatibility ratingUL listedCompletely pin-hole free barrier coatingFully conformal on any type of surface material or designInert transparent polymerMeets NBC requirements (AR70 / AFR80-38 / Navinst 3400.2)Barrier to oxygen, moisture, chemicals, solvents, and carbon dioxideThermal mechanically stable between -200ºC and 150ºCExtremely high dielectric 5,000 volts per 0.001" minimumExcellent adhesion propertiesLow stress coating that does not form sites prone to crack initiationLow / minimal impact on package coolingHydrophobicBarrier to ionic and moisture speciesChemical and fungal resistanceNon-contaminating coating and coating process -- no solvents, catalysts or other by-products are introduced during coatingEntire process is accomplished at room temperature, alleviating temperature stress on partsParticle encapsulation / immobilizationNo outgassing (NASA approved)High reliability - Suitable for military or commercial applicationsLight weight - compared to other coatingsStress-free coatings - Sensitive circuitry unchanged by coatingLow coefficient of friction - Use as a dry film lubricantTransparency - Thin films can be of optical qualityOutgassing - Virtually noneOutstanding barrier - Very low permeability to moisture and gasesFungus and bacteria resistance - ExcellentMechanical - High tensile and yield strengthRadiation resistance - Suitable for space applications
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