This is the simplest etching technology. All it requires is a container with a liquid solution that will dissolve the material in question. Unfortunately, there are complications since usually a mask is desired to selectively etch the material. One must find a mask that will not dissolve or at least etches much slower than the material to be patterned. Secondly, some single crystal materials, such as silicon, exhibit anisotropic etching in certain chemicals. Anisotropic etching in contrast to isotropic etching means different etch rates in different directions in the material. The classic example of this is the crystal plane sidewalls that appear when etching a hole in a silicon wafer in a chemical such as potassium hydroxide (KOH). The result is a pyramid shaped hole instead of a hole with rounded sidewalls with a isotropic etchant. The principle of anisotropic and isotropic wet etching is illustrated in the figure below