[Bonding position]
I think the best condition is adhesive "A-01" used and improved from your test results,
because of terminal strength after bonding and Reflow mounting, resistance to solder and temperature, remaining on terminal surface.
I almost agree your idea of improve position as below.
But, I'm worry about "risk of bond over to Karage pin" because this position is flat and small.
idea of New position for improve
the risk of product
Spred of adhesive after rivet core assy
In my opinion, new position and MP position MIX 2 point is better, or 3 point best.
I think 2 point bonding is enough for solder heating and 3 point is pretty difficult to bonding for Auto M/C in the furture.
In other idea, Nomal position for MP running will be modified like as this test new position.
Movement of bonding is become to though the bent of bottom.