After the cleaning procedure, a 30 nm thick SiO2 layer has been prepared by means of thermal dryoxidation in a pre-heated oven (Tempress) at a temperature of 1000 ◦C (step a).
After the cleaning procedure, a 30 nm thick SiO2 layer has been prepared by means of thermal dryoxidation in a pre-heated oven (Tempress) at a temperature of 1000 ◦C (step a).