Abstract
This report summarizes what the author has learnt and experienced as part of the Research and Development team at United Test and Assembly Center (UTAC). She was assigned to the thermal test and worked in the Package Characterization Lab as part of the 22 weeks Industrial Attachment by NTU. During this attachment period, the author gained hands-on experience, research skills, professional skills and experience life as an engineer in a semiconductor company. This report will provide a general layout of the company’s structure. At the same time, it will give a brief and concise introduction to the theories related to the work scope of the author. Lastly, this report will provide a detailed insight of the project undertaken by the author, the equipment used, the results collected and drawing conclusions from it