The optimization results are shown in the form of Pareto plots in Fig. 8 due to conflicting optimization objectives. Comparing the optimization results for all cases, it is clear that optimizing both the manifold and microchannel yields better results compared to the results obtained for optimizing the manifold only. This seems logical because optimization of both manifold and microchannel geometries means fully utilizing the potential of the manifold- microchannel technology. In addition, copper shows superior performance to nickel, which was expected, since copper has higher thermal conductivity than nickel. The gap between the optimum design of copper and nickel decreases for low heat transfer density where the mass flow rate is low. This is because heat transfer density is less dependent on fin and base material in this region
since the thermal conduction resistance becomes less determinative
as compared to convection thermal resistance.