Proper ramp rates will ensure that good solder joint grain structure will form and that potential thermal damage associated with coefficient of thermal expansion (CTE) mismatches between components and board materials will be minimized. Soak times permit components to achieve improved temperature equilibriums across a thermally challenging board before ramping to reflow peak temperatures. Time-above-liquidus parameters promote good wetting and ensure minimal embrittlement-causing intermetallic buildup within the solder interconnect. Component lead peak temperature requirements also are critical to ensure that the solder reflows properly and there is no thermal damage to the components or board. High-temperature exposure may cause internal damage to components, resulting in popcorning or molding compound delamination from the lead frame or die paddle, creating long-term reliability problems