first layer is positively doped siliconwafer.the doped silicon wafer is coated with an insulating layer of silicon dioxide.an ultraviolet-sensitive layer of photoresist is applied to the silicon dioxide surface.the first mask is placed over the wafer and ultraviolet light is projected on to the mask Areas of photoresist exposed to the light are hardened and those shielded remain soft.the soft photoresist is removed by wa shing with a solvent.the upper layer of the silicon dioxide is removed by hot gasses and solvent leaving silicon dioxide cover the entive wafer. a layer of polysilicon is then deposited on to the silicon dioxide(transistor's gate).