6. Conclusion
A novel mechanistic model of TMA + H2O ALD process is devel- oped in this study, which integrates the continuum transport pro- cesses in the ALD reactor with the detailed chemical processes on silicon wafer surface. The surface species variation within two pre- cursor pulses is simulated during ALD cycling operation .The model is validated using the experimental data under both 1 Torr and 0.8 Torr conditions. Upon the model validation, numerical studies are extensively performed with emphasis on the ALD process dynamics. Numerical results indicate that with sufficient precur- sors, the position diversity of the silicon wafer surface sites has little effect on the homogeneous alumina film growth in the experiment. By applying different operation temperature, the experimental and numerical results show that the ALD-grown film growth is determined by the temperature dependent surface reactions and gas flow in reactor. The modeling results of different system pressure indicate that suitably increasing ALD operation pressure can not only improve the completion of surface reactions in the cycling, but also improve the production of ALD grown film on the silicon wafer surface. The sensitivity analysis of surface reactions on the surface species formation and reaction duration is finally performed. It is found that |–OH, |–Al(CH3)2 and |–Al(CH3)1 have different degree of sensitivities to the surface reaction rates. It also shows that the related reaction time in TMA half cycles is very sensitive to the elementary reaction of |–Al(CH3)2 formation, while in the H2O half cycle, it is sensitive to both the adsorption rate of H2O and the elementary reaction of |–Al(CH3)1 formation.
6. บทสรุปA novel mechanistic model of TMA + H2O ALD process is devel- oped in this study, which integrates the continuum transport pro- cesses in the ALD reactor with the detailed chemical processes on silicon wafer surface. The surface species variation within two pre- cursor pulses is simulated during ALD cycling operation .The model is validated using the experimental data under both 1 Torr and 0.8 Torr conditions. Upon the model validation, numerical studies are extensively performed with emphasis on the ALD process dynamics. Numerical results indicate that with sufficient precur- sors, the position diversity of the silicon wafer surface sites has little effect on the homogeneous alumina film growth in the experiment. By applying different operation temperature, the experimental and numerical results show that the ALD-grown film growth is determined by the temperature dependent surface reactions and gas flow in reactor. The modeling results of different system pressure indicate that suitably increasing ALD operation pressure can not only improve the completion of surface reactions in the cycling, but also improve the production of ALD grown film on the silicon wafer surface. The sensitivity analysis of surface reactions on the surface species formation and reaction duration is finally performed. It is found that |–OH, |–Al(CH3)2 and |–Al(CH3)1 have different degree of sensitivities to the surface reaction rates. It also shows that the related reaction time in TMA half cycles is very sensitive to the elementary reaction of |–Al(CH3)2 formation, while in the H2O half cycle, it is sensitive to both the adsorption rate of H2O and the elementary reaction of |–Al(CH3)1 formation.
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