Thin films of silicon carbide possessing unique properties attract increasing attention of
researchers both in the field of semiconductor physics and in the technology of new
semiconductor devices for high power, RF and optoelectronics. The growth of the production
of silicon carbide based devices promotes the search for more resource saving and safe SiC layer
synthesis technologies. Potential method is pulse laser deposition (PLD) in vacuum. This
technology does not require the use of chemically aggressive and explosive gases and allows
forming thin and continuous coatings with thicknesses of from several nanometers at relatively
low substrate temperatures. Submicron thickness silicon carbide films have been grown on
single crystal silicon by vacuum laser ablation of a ceramic target. The physical and
technological parameters of silicon carbide thin film low temperature synthesis by PLD have
been studied and, in particular, the effect of temperature and substrate crystalline orientation
on the composition, structural properties and morphology of the surface of the experimental
specimens has been analyzed. At above 500 1C the crystalline β-SiC phase forms on Si (100) and
(111). At a substrate temperature of 950 1C the formation of textured heteroepitaxial 3C–SiC
films was observed