[4,6].
In the present work, we propose to use a mixed
approach with, on the one hand, an instrument molding
device allowing the production of adhesion peeling test
samples under well controlled curing temperature cycles
and, on the other hand, two efficient kinetic models of the
rubber cure reaction, allowing prediction of the influence of
temperature cure cycles on the bulk state of the rubber.
[4,6].In the present work, we propose to use a mixedapproach with, on the one hand, an instrument moldingdevice allowing the production of adhesion peeling testsamples under well controlled curing temperature cyclesand, on the other hand, two efficient kinetic models of therubber cure reaction, allowing prediction of the influence oftemperature cure cycles on the bulk state of the rubber.
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