A variation of casting that is important to the electrical and electronics industry is potting and encapsulation This process involves casting the plastic around an electrical component to embed it in the plastic.
Potting (Fig. 1X. 14b) is done in a housing or case, which is an integral pan of the product In encapsulation (Fig. 18.14c), the component is coated with a layer of the solidified plastic. In both applications, the plastic serves as a dielectric (nonconductor). Structural members, such as hooks and studs, may be partly encapsulated.
FIGURE 18.14 Schematic illustration of (a) casting (b) potting, (c) encapsulation of plastics.