The thermal decomposition (including the fluidized bed combustion and pyrolysis treatment), nitric acid dissolution and solvent dissolution processes are relatively more effective for removal of EVA which is the commonly used adhesive in PV panels. Thermal decomposition is the currently commonly applied technology for Si module delamination. It is relatively simple and economically feasible. The nitric acid dissolution and thermal treatments are generally more efficient than solvent dis- solution, but the solvent dissolution process a more effective separation of EVA and glass with less damages to PV cells.