The device consists of a precise, low-offset, linear Hall circuit
with a copper conduction path located near the surface of the
die. Applied current flowing through this copper conduction
path generates a magnetic field which the Hall IC converts into a
proportional voltage. Device accuracy is optimized through the
close proximity of the magnetic signal to the Hall transducer.
A precise, proportional voltage is provided by the low-offset,
chopper-stabilized BiCMOS Hall IC, which is programmed
for accuracy after packaging.