Current is supplied to the chip through 5600 bumps, which
are about equally divided between and bumps. A lot
of emphasis was placed on maintaining continuity of the power
grid wherever possible. All the global metals from M11–M7 are
continuous in most parts of the chip and the lower level grids are
stitched together wherever possible. A minimum of 2 2 vias
were required at every power grid intersection. The power grid
in each metal layer was made symmetric; this allowed block
layouts to be easily reused even if blocks are flipped.