The development trend of electronic devices, such as LED chips
and CPU chips, gradually become miniaturized and integrated,
which account for the over concentration of the high heat flux in
the device. The adverse thermal environment can seriously
degrade the performance and service lives of electronic devices
[1]. The advanced cooling technology is needed to solve the ther-
mal problem of the electronic device. Heat pipe technology that
utilizes the phase change latent heat of working fluid and transfers
the high heat flux fromhot side to cold side is expected to solve the
thermal problem of electronic devices. In order to improve and
strengthen the heat transport performance of heat pipes, finding
out a suitable working fluid is one of the most direct and effective
ways