As chip size decreases, the traditional intermediate carrier process becomes more challenging, as the alignment requirement (RFID chip to antenna pad) becomes more demanding. As a result, there have been developments focused on providing a “standardized” RFID chip delivery method using an intermediate attachment mechanism. This approach calls for the semiconductor manufacture to deliver the RFID chips attached to a standardized delivery structure (carrier, tabs, interposers, etc.). The inlay manufacturer/label converter can then handle the RFID chips (subassemblies) in a standardized manner since the connection structure to which they are attached is “fixed”, independent of the chip size. Additionally, the carriers to which they attach the antenna have a physically larger structure allowing greater flexibility and reduced precision requirements.