Harris corporation’s RF communications Division, located in Melbourne, florida, is a major manufacturer of point-to-point radio communication equipment. It is a horizontally integrated manufacturing company with a multiplant facility Most of the harris products require medium to high volume production operations including printed circuit assembly, final product assembly, and testing one of the company’s high volume products uses an assembly called an RF deck. Each RF deck consists. Of 16 electronic components soldered to a machined casting which forms the plated surface on the deck. During a manufacturing run, a problem developed in the soldering process, the flow of solder onto the deck did not meet the quality criteria established for the product. After considering a variety of factors the might affect the soldering process , an engineer made the preliminary determination that the soldering problem was most like due to defective plating
The question raised by the engineer was, did the proportion of defective platings in the Harris inventory exceed the supplier’s design specification? Letting p indicate the proportion of defaective platings in the Harris inventory and po indicate the proportion of defective plating under the supplier’s design specifications, the following hypotheses were formulated
Harris corporation’s RF communications Division, located in Melbourne, florida, is a major manufacturer of point-to-point radio communication equipment. It is a horizontally integrated manufacturing company with a multiplant facility Most of the harris products require medium to high volume production operations including printed circuit assembly, final product assembly, and testing one of the company’s high volume products uses an assembly called an RF deck. Each RF deck consists. Of 16 electronic components soldered to a machined casting which forms the plated surface on the deck. During a manufacturing run, a problem developed in the soldering process, the flow of solder onto the deck did not meet the quality criteria established for the product. After considering a variety of factors the might affect the soldering process , an engineer made the preliminary determination that the soldering problem was most like due to defective plating
The question raised by the engineer was, did the proportion of defective platings in the Harris inventory exceed the supplier’s design specification? Letting p indicate the proportion of defaective platings in the Harris inventory and po indicate the proportion of defective plating under the supplier’s design specifications, the following hypotheses were formulated
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