What is the difference between potting, casting and encapsulating in electronics processing?
Potting
The potting method uses a “pot” or case or shell to put the device in and then pour the liquid potting compound to the top of the case covering the device and completely encasing it. The case becomes part of the finished unit. This is the most common method used, especially for high speed and many-units-per-hour production-line conditions.
Casting
The casting method is the same idea but instead of a case that stays apart of the unit a mold is use and removed after the potting compound has hardened. Sometimes this is also referred to as encapsulation. This is used when a molded unit is desired.
Encapsulation
The encapsulation method is also referred to when a device is dipped into a resin system and a thick coating completely surrounds the unit. Sometimes this is just called a “dip coating”. Molded device is a normally described as an encapsulated unit.