While the least stress difference was observed between the AlN deposited on Au and that deposited on Si, the short circuit path formed between the bottom and top electrodes through the Si wafer hinders its use as a suitable base material. Al2O3 is identified as a suitable underlying material below the Au electrode since the AlN film deposited on the Au-Al2O3 showed no cracking at the step edge or short circuiting between the top and bottom electrodes. AlN piezoelectric force sensors were successfully fabricated on Al2O3 coated Si wafers and their charge-to-force coefficient in the longitudinal direction (d33) was characterized to be ∼6.48 pC/N.