POTTING
AN ENCAPSULATE OR POTTING COMPOUND IS A LIQUID RESIN SYSTEM
COMPRISED OF EITHER ONE OR TWO COMPONENTS THAT IS POURED OVER
ELECTRICAL AND ELECTRONIC COMPONENTS OR CIRCUIT BOARDS.
THESE ENCAPSULATING RESINS ARE DESIGNED FOR A VARIETY OF
APPLICATIONS TO PROTECT THE PRODUCT INCLUDING ELECTRICAL
INSULATION, ENVIRONMENTAL PROTECTION FROM MOISTURE, WATER AND
CHEMICALS AND MECHANICAL ATTACK FROM THERMAL SHOCK AND VIBRATION.
THIS PROTECTION ALLOWS THESE ELECTRONICS TO BE USED IN MANY MORE
APPLICATIONS ENSURING RELIABLE, LONG-TERM PERFORMANCE.
THIS PROCESS CAN BE DONE BY SEVERAL METHODS: POTTING, CASTING AND
ENCAPSULATION. MANY NAMES HAVE BEEN USED INTERCHANGEABLY SO
THERE IS SOME CONFUSION OF THE TERMS. THE MOST COMMONLY USED TERM
IS ENCAPSULATION OR POTTING.