In summary, the role of the Oxone in the slurry could be essentially chemical, affecting only the creation of a hydrophobic layer on the surface of the abrasive, and not the size of the particles formed at the initial pH-value of 12. Thus, one can obtain low roughness surface and a high quality in the polishing results with Oxone oxidizer at low concentrations.
4. Conclusions
As a novelty, a new CMP process to obtain lower values either MRR or roughness on the surface is proposed. For this, two new oxidizers, K2S2O7 and Oxone are used, because of their chemical properties.
After performing both chemical and mechanical polishing processes studies in small but suitable sized samples, one come to the conclusion that the best conditions to achieve a smooth surface without subsurface damage is the use of CeO2 as abrasive, at a pressure of 100 kPa, a flow rate of 10 ml/min and 40 rpm as a speed of the plate.
Regarding the chemical parameters of the oxidizer, taking into account the roughness and the MRR obtained, one of the best options would be the use of Oxone in a concentration of 0.25%.
In summary, the role of the Oxone in the slurry could be essentially chemical, affecting only the creation of a hydrophobic layer on the surface of the abrasive, and not the size of the particles formed at the initial pH-value of 12. Thus, one can obtain low roughness surface and a high quality in the polishing results with Oxone oxidizer at low concentrations.4. ConclusionsAs a novelty, a new CMP process to obtain lower values either MRR or roughness on the surface is proposed. For this, two new oxidizers, K2S2O7 and Oxone are used, because of their chemical properties.After performing both chemical and mechanical polishing processes studies in small but suitable sized samples, one come to the conclusion that the best conditions to achieve a smooth surface without subsurface damage is the use of CeO2 as abrasive, at a pressure of 100 kPa, a flow rate of 10 ml/min and 40 rpm as a speed of the plate.Regarding the chemical parameters of the oxidizer, taking into account the roughness and the MRR obtained, one of the best options would be the use of Oxone in a concentration of 0.25%.
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