Quite opposite behavior can be ovserved for the
curing of UF2 adhesive. Its curing reaction starts at
higher temperatures and its activation energy decreases
as the curing process proceeds. The reason for
such behavior of UF2 adhesive might be explained by
its lower F/U ratio. This could probably influence the
insufficiency of formaldehyde needed for both cross-
-linking reactions (amino-methylene links) and for the
creation of hexamethylenetetramine and hydrochloric
acid in the reaction with ammonium chloride as catalyst.