Fig. 1b exhibits the fracture surface of the composite
under a sintering time of 4 h it can be seen that no exposed SiC
particles or coarse silicon particles exist in the fracture surface,was reported by N Chawla and Tran Huu Nam[4,5] et al., they found
that the thermal expansion behaviorwas strongly influenced by the
presence of voids and internal stress, and then resulted in
decreasing the CTE.